1825532-4 Details_1825532-4 Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	-
Type	SIP
Number of Positions or Pins (Grid)	10 (1 x 10)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	Flash
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	Flash
Contact Material - Post	Beryllium Copper
Housing Material	Polyester
Operating Temperature	-

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