822-AG11D Details_822-AG11D Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	800
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	22 (2 x 11)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	25.0µin (0.63µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	80.0µin (2.03µm)
Contact Material - Post	Copper Alloy
Housing Material	Polyester
Operating Temperature	-55°C ~ 105°C

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