678-39-C Details_678-39-C Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	678
Package	Box
Type	Board Level, Vertical
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Clip, Solder Foot
Shape	Rectangular, Fins
Length	2.362" (60.00mm)
Width	0.984" (25.00mm)
Diameter	-
Fin Height	1.520" (38.61mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	0.60°C/W @ 600 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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