RAS-HS50-KIT Details_RAS-HS50-KIT Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Retail Package
Type	Top Mount Kit
Package Cooled	Development Boards, Raspberri Pi
Attachment Method	-
Shape	-
Length	-
Width	-
Diameter	-
Fin Height	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	-
Material	-
Material Finish	-

Other

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