H30300800000G Details_H30300800000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	H3
Package	Bulk
Number of Levels	1
Positions Per Level	3
Pitch	0.197" (5.00mm)
Mating Orientation	45° (135°) Angle with Board
Current	10 A
Voltage	300 V
Wire Gauge	12-28 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Interlocking (Side)
Color	Gray

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Winwic Technology Co., Limited

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