H80810810000G Details_H80810810000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	H8
Package	Bulk
Number of Levels	1
Positions Per Level	8
Pitch	0.591" (15.00mm)
Mating Orientation	45° (135°) Angle with Board
Current	37 A
Voltage	600 V
Wire Gauge	6-24 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Flange
Color	Gray

Other

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