H20800800000G Details_H20800800000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	H2
Package	Bulk
Number of Levels	1
Positions Per Level	8
Pitch	0.295" (7.50mm)
Mating Orientation	45° (135°) Angle with Board
Current	10 A
Voltage	300 V
Wire Gauge	10-24 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Interlocking (Side)
Color	Gray

Other

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Winwic Technology Co., Limited

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Phone: 852-54217895

Address: KCITY building 9. room 19E. Kaitak KWOONLON HongKong

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