H90850500000G Details_H90850500000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	H9
Package	Bulk
Number of Levels	2
Positions Per Level	8
Pitch	0.200" (5.08mm)
Mating Orientation	60° (120°) Angle with Board
Current	15 A
Voltage	300 V
Wire Gauge	14-28 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Lever Actuated
Color	Green

Other

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