2013620-1 Details_2013620-1 Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	989 (35 x 36)
Pitch - Mating	0.039" (1.00mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	15.0µin (0.38µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.039" (1.00mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic
Operating Temperature	-

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