2-5916783-3 Details_2-5916783-3 Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	370 (19 x 19)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Copper Alloy
Housing Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-

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