2-382882-1 Details_2-382882-1 Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Diplomate DL
Package	Box
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	6 (2 x 3)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Thermoplastic, Glass Filled
Operating Temperature	-55°C ~ 105°C

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