115-87-210-41-001101 Details_115-87-210-41-001101 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	115
Package	Bulk
Type	DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)	10 (2 x 5)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	Flash
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

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