228-5204-01 Details_228-5204-01 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Textool™
Package	Bulk
Type	QFN
Number of Positions or Pins (Grid)	28 (4 x 7)
Pitch - Mating	0.020" (0.50mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES)
Operating Temperature	-

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Winwic Technology Co., Limited

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