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Sockets for ICs Transistors
550-10-560M33-001152 Picture

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550-10-560M33-001152

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  • BGA SOLDER TAIL
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In Stock:17,404(Ref. price)
Qty.Unit PriceExt. Price
1
$50.00724
$50.00724
Documents
Specifications
DescriptionDetails
Series
550
Package
Bulk
Type
BGA
Number of Positions or Pins (Grid)
560 (33 x 33)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Brass
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55°C ~ 125°C
Other
Price advantage, 550-10-560M33-001152 is available in stock and can be delivered on the same day
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