317-93-113-41-005000 Details_317-93-113-41-005000 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	317
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	13 (1 x 13)
Pitch - Mating	0.070" (1.78mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C

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