551-90-225-18-091003 Details_551-90-225-18-091003 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	551
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	225 (18 x 18)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	-
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-

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