IC-316-SGG Details_IC-316-SGG Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	IC
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

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Price advantage, IC-316-SGG is available in stock and can be delivered on the same day

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