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Sockets for ICs Transistors
5-1437542-8 Picture

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5-1437542-8

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Documents
Specifications
DescriptionDetails
Series
700
Package
-
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
20.0µin (0.51µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Carrier, Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
20.0µin (0.51µm)
Contact Material - Post
Beryllium Copper
Housing Material
Aluminum Alloy
Operating Temperature
-55°C ~ 125°C
Other
Price advantage, 5-1437542-8 is available in stock and can be delivered on the same day
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