241-18-1-03 Details_241-18-1-03 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tube
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	60.0µin (1.52µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	60.0µin (1.52µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-40°C ~ 105°C

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