1-2199299-2 Details_1-2199299-2 Related parameters PDF_TE Connectivity AMP Connectors-Winwic

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Diplomate DL
Package	Bulk
Type	DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	60.0µin (1.52µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	60.0µin (1.52µm)
Contact Material - Post	Nickel
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-40°C ~ 105°C

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