240-4846-00-3303 Details_240-4846-00-3303 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	OEM
Package	Bulk
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	40 (2 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	250.0µin (6.35µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	250.0µin (6.35µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyether Imide (PEI), Glass Filled
Operating Temperature	-55°C ~ 105°C

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