240-3639-00-0602J Details_240-3639-00-0602J Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Textool™
Package	Bulk
Type	DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Number of Positions or Pins (Grid)	40 (2 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Connector
Features	Closed Frame
Termination	Press-Fit
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled
Operating Temperature	-55°C ~ 125°C

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